Electronic Manufacturing,PCB assembly,PCB Manufacturing

PCB Assembly

PCB Manufacturing

Items Mass Prototypes
Layers 1-12 Layers 1-36 Layers
Max. Panel Size 600*770mm( 23.62"*30.31") 600*770mm(23.62"*30.31") 500*1200mm(19.69"*47.24")
Max.Board Thickness 8.5mm 8.5mm
Min. Board Thickness 2L:0.3mm 2L:0.2mm
4L:0.4mm 4L:0.4mm
6L:0.8mm 6L:0.6mm
Min Inner Layer Clearance 0.1mm(4mil) 0.1mm(4mil)
Min Line width 0.1mm(4/4 mil) 0.075mm(3/3 mil)
Min Line space 0.1mm(4/4 mil) 0.075mm(3/3 mil)
Min.Hole Size 0.2mm(8mil) 0.15mm(6mil)
Min plated hole thickness 20um(0.8mil) 20um(0.8mil)
Min Blind/Buried hole size 0.2mm(8mil) 0.2mm(1-8layers)(8mil)
PTH Dia. Tolerance ±0.076mm(±3mil) ±0.076mm(±3mil)
Non PTH Dia. Tolerance ±0.05mm(±2mil) ±0.05mm(±2mil)
Hole Position Deviation ±0.05mm(±2mil) ±0.05mm(±2mil)
Heavy Coppe 4OZ/140μm 6OZ/175μm
Min S/M Pitch 0.1mm (4mil) 0.1mm (4mil)
Soldermask colour Green,black,Blue,White,Yellow,Red Green,black,Blue,White,Yellow,Red
Silkscreen colour White,Yellow,Red,Black White,Yellow,Red,Black
Outline Routing,V-Groove, Beveling punch Routing,V-Groove, Beveling punch
Outline Tolerance ±0.15mm ±6mil ±0.15mm (±6mil)
Peelable mask Top,bottom,double sided Top,bottom,double sided
Controlled Impedance +/- 10% +/- 7%
Insulation Resistance 1×1012Ω(Normal) 1×1012Ω(Normal)
Through Hole Resistance <300Ω(Normal) <300Ω(Normal)
Thermal Shock 3×10sec@288℃ 3×10sec@288℃
Warp and Twist ≤0.7% ≤0.7%
Electric Strength >1.3KV/mm >1.4KV/mm
Peel Strength 1.4N/mm 1.4N/mm
Solder Mask Abrasion >6H >6H
Flammability 94V-0 94V-0
Test Voltage 50-330V 50-330V
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